Title:
半導体素子
Document Type and Number:
Japanese Patent JP4779291
Kind Code:
B2
Inventors:
Hirokazu Hirose
Koichi Hikita
Koichi Hikita
Application Number:
JP2003271126A
Publication Date:
September 28, 2011
Filing Date:
July 04, 2003
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L21/331; H01L27/082; H01L21/8222; H01L29/06; H01L29/732
Domestic Patent References:
| JP2194534A | ||||
| JP64025564A | ||||
| JP59132648A | ||||
| JP59079567A | ||||
| JP55059768A |
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Takanori Mamoru