Title:
プリント基板加工機及びその穴明け加工方法
Document Type and Number:
Japanese Patent JP4787771
Kind Code:
B2
Abstract:
The device has printed circuit boards (1a, 1b) mounted on respective tables (2a, 2b), and a control unit controlling an X-axis drive section (3a) and a Y-axis drive section (7a) to move an X-direction axle and Y-direction axle in a direction. The axles are positioned in processing positions by the X-axis drive section and a Y-axis drive section. The axes are determined such that drills are put into a printed circuit board by a Z-axis drive section to drill holes. The z-axis drive section moves a spindle (5a) into corresponding z-direction. An independent claim is also included for a method for drilling a printed circuit board processing device.
Inventors:
Kazuo Watanabe
Kumagai Tokunari
Katsuhiro Nagasawa
Takahiko Yamashita
Hiroyuki Kamata
Koshizuka Hisahiro
Hiroyuki Sugawara
Toru Miyasaka
Kumagai Tokunari
Katsuhiro Nagasawa
Takahiko Yamashita
Hiroyuki Kamata
Koshizuka Hisahiro
Hiroyuki Sugawara
Toru Miyasaka
Application Number:
JP2007032253A
Publication Date:
October 05, 2011
Filing Date:
February 13, 2007
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
B26F1/16; B23B39/24
Domestic Patent References:
| JP7314395A | ||||
| JP2002160104A | ||||
| JP3003398A | ||||
| JP2001138118A | ||||
| JP2004306206A |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office