Title:
圧電体装置の製造方法
Document Type and Number:
Japanese Patent JP4800489
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress deteriorations and variations in the characteristics of the vibrating portions of piezoelectric-substance devices in their manufacturing method which are caused by their bonding agents as to improve their characteristics, and to perform their low-temperature joinings. SOLUTION: In the method of manufacturing the piezoelectric-substance device, when a substrate having provided metal films on its junction surface and a piezoelectric substance having provided metal films on its junction surface are joined to each other, their joining is performed while vibrating the piezoelectric substance itself by applying a voltage to it.
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Inventors:
Wakabayashi Mari
Application Number:
JP2001000494A
Publication Date:
October 26, 2011
Filing Date:
January 05, 2001
Export Citation:
Assignee:
Seiko Instruments Inc.
International Classes:
H01L41/22; H01L41/09; H01L41/312; H02N2/00
Domestic Patent References:
| JP2000261058A | ||||
| JP9045973A | ||||
| JP2000308377A | ||||
| JP5124204A | ||||
| JP4043395U | ||||
| JP58099100A | ||||
| JP7038361A | ||||
| JP2002141576A |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura