Title:
リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法
Document Type and Number:
Japanese Patent JP4801243
Kind Code:
B2
Abstract:
A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames each are formed with positioning holes. Element loading portions to be loaded with semiconductor elements are connected to the outside frames by such tie bars. The lead frame is therefore free from deformation during lead forming while promoting the miniaturization of the semiconductor devices.
Inventors:
Hiroki Hirasawa
Hiroyuki Kimura
Hiroyuki Kimura
Application Number:
JP2000239396A
Publication Date:
October 26, 2011
Filing Date:
August 08, 2000
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L23/28; H01L21/56; H01L31/12; H01L23/29; H01L23/31; H01L23/48; H01L23/495; H01L23/50; H01L25/16; H01L31/167
Domestic Patent References:
| JP2294058A | ||||
| JP7321370A | ||||
| JP9083013A | ||||
| JP7297344A |
Attorney, Agent or Firm:
Shinji Hayami
Kana Nomoto
Satoshi Amagi
Kana Nomoto
Satoshi Amagi