Title:
ウエーハの処理装置
Document Type and Number:
Japanese Patent JP4806282
Kind Code:
B2
Abstract:
A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer. The processing method further includes: removing at least the projection of the peripheral reinforcing portion of the wafer; and transferring the wafer after the removing. In the removing, while the wafer is held on a holding table such that the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table, at least the projection of the peripheral reinforcing portion is removed. After the removing of at least the projection, while the wafer is held on the holding table, a holding tape is applied to the rear surface of the wafer and the holding tape is supported by a frame. In the transferring, the wafer having the holding tape applied thereon is separated together with the frame from the holding table and is transferred together with the frame.
Inventors:
Keiichi Kajiyama
Takatoshi Masuda
Takatoshi Masuda
Application Number:
JP2006090235A
Publication Date:
November 02, 2011
Filing Date:
March 29, 2006
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2002299196A | ||||
| JP2004281551A | ||||
| JP10233431A |
Foreign References:
| WO2004001819A1 |
Attorney, Agent or Firm:
Suenari Mikio