Title:
半導体装置、回路配線基板及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4888096
Kind Code:
B2
Inventors:
Kozo Shimizu
Application Number:
JP2006332123A
Publication Date:
February 29, 2012
Filing Date:
December 08, 2006
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/60
Domestic Patent References:
| JP2006013195A | ||||
| JP2006156492A | ||||
| JP2002110726A | ||||
| JP8191073A |
Attorney, Agent or Firm:
Takeshi Hattori