Title:
電子部品用銅系基材及び電子部品
Document Type and Number:
Japanese Patent JP4908801
Kind Code:
B2
Abstract:
A copper base for an electronic component includes a silicon oxide thin film containing at least one of a hydrocarbon group and a hydroxy group is used, the silicon oxide thin film being disposed on a surface of the copper base. Furthermore, a silicon-containing reaction gas is decomposed by generating plasma. The resulting decomposition product is brought into contact with the copper base to form a silicon oxide thin film on a surface of the copper base.
Inventors:
Kazushi Hayashi
Kugimiya Toshihiro
Kugimiya Toshihiro
Application Number:
JP2005236052A
Publication Date:
April 04, 2012
Filing Date:
August 16, 2005
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
H01L23/373; H01L21/768; H01L23/28; H01L23/50; H01L23/522
Domestic Patent References:
| JP10189857A | ||||
| JP2004152972A | ||||
| JP4289173A | ||||
| JP3175632A | ||||
| JP215629A | ||||
| JP2004107788A |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Toda Shunza
Masataka Otani
Toda Shunza