Title:
導体ペーストおよび厚膜回路用基板
Document Type and Number:
Japanese Patent JP4933998
Kind Code:
B2
Inventors:
Kengo Toda
Seiji Shimanoue
Seiji Shimanoue
Application Number:
JP2007255652A
Publication Date:
May 16, 2012
Filing Date:
September 28, 2007
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
H01B1/22; H01L23/13; H01L23/14; H05K1/09; H05K1/11; H05K3/40
Domestic Patent References:
| JP11163487A | ||||
| JP10135630A |
Attorney, Agent or Firm:
Haruyuki Ikeda
Kojiro Ikeda
Kojiro Ikeda