To prevent a filler from infiltrating in a resin that is running around to the outer surface of one-side metal plate, in a manufacturing method of a semiconductor device that is implemented, such that a part between two metal plates sandwiching semiconductor elements between their inner surface sides, and the outer surface of one-side metal plate are sealed by a resin, and thereafter, the resin adhering to the outer surface of the one-side metal plate is ground to expose the outer surface.
In a process of installing a workpiece W with semiconductor elements 1 and 2 sandwiched between both metal plates 3 and 4 in a die 200, pressing the outer surface 4b of the one-side metal plate 4 against the die 200, injecting a resin 7 into the die 200, in a state where a space 204 is formed between the outer surface 3b of the other-side metal plate 3 and the die 200, and filling the resin 7 in the space 204, the clearance L of the space 204 is set smaller than the minimum particle diameter of the filler 71 in the mold resin 7.
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Tadayoshi Okura
| JP2007073583A | ||||
| JP4132245A |
Takahiro Miura
Fumihiro Mizuno