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Title:
基板処理装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4961179
Kind Code:
B2
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Inventors:
Koichiro Harada
Application Number:
JP2006216028A
Publication Date:
June 27, 2012
Filing Date:
August 08, 2006
Export Citation:
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Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/683; C23C16/458; H01L21/205
Domestic Patent References:
JP2002134487A
JP4206545A
JP2005142591A
JP6349810A
JP2005064284A
JP200767394A
JP2003142566A
JP8195428A
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono
Fukuoka Masahiro



 
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