Title:
放熱基板およびその製造方法
Document Type and Number:
Japanese Patent JP4964322
Kind Code:
B2
Inventors:
KIM,Dae Hoon
Shin, San Hyun
Park, Ji Hyun
Shin, San Hyun
Park, Ji Hyun
Application Number:
JP2010097185A
Publication Date:
June 27, 2012
Filing Date:
April 20, 2010
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K1/05; H05K3/44
Domestic Patent References:
| JP62117350A | ||||
| JP10135593A | ||||
| JP2006165363A |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike