To provide a board connection structure for connecting boards via solder bumps which structure prevents short circuit between the solder bumps caused by deformation of the solder bumps, and connects the boards firmly using an underfill.

In the board connection structure, a pillarlike structure 4 made of an insulating material is disposed between the solder bumps 3 closest to each other, and a gap between the connected boards 1 and 2 is filled with the underfill 5. The deformed solder bumps 3 are blocked by the pillarlike structure 4 made of the insulating material, which prevents short circuit between the adjacent solder bumps 3. The plane of the pillarlike structure 4 and that of the solder bump 3 are separated from each other, so that the inflow of the underfill from the periphery of the structure 4 and solder bump 3 is not obstructed to allow firm connection through the underfill 5 with less voids.

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