To prevent oxidation of a thermocouple to extend longevity of the same, to enable long-term continuous usage of a heater chip, and to improve an operating rate of a joint apparatus and to reduce a maintenance cost.

In a heater chip 20 for high temperature pulse heating, which is used for joining the other electronic component to an electrode 12 of an electronic component 10, a hot junction 32 of a thermocouple 28 for feedback control of a joint temperature is fixed in the vicinity of a pressure welding part 24 which is pressure-welded to a junction part 18 of both electronic components 10, and whole of the heater chip 20 including at least the hot junction 32 of the thermocouple 28 is covered by anti-oxidation ceramic coating.

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