Title:
電子アセンブリ
Document Type and Number:
Japanese Patent JP5036985
Kind Code:
B2
Abstract:
The electronic assembly, comprising a printed circuit (1) and a housing (3, 4) that provides thermal and/or electrical insulation and has a thermal drain (2, 5, 6) with an interface layer complex. The latter is located between faces of the printed circuit and housing, extending over the major part of the printed circuit surface and having an adhesive coating on each side for attaching to the printed circuit and the housing. The housing has an additional fixing in the form of a projection (9) that engages with holes (10, 11) in the interface layer and printed circuit.
Inventors:
Marc Dualte
Jean-Marc Nikolai
David Mitte
Fabrice Govin
Jean-Marc Nikolai
David Mitte
Fabrice Govin
Application Number:
JP2005200777A
Publication Date:
September 26, 2012
Filing Date:
July 08, 2005
Export Citation:
Assignee:
VALEO VISION
International Classes:
H05K7/20
Domestic Patent References:
| JP63219196A | ||||
| JP2004031495A | ||||
| JP2001135963A | ||||
| JP3159187A | ||||
| JP1164099A |
Attorney, Agent or Firm:
Soichi Takezawa
Noritsugu Nakama
Noritsugu Nakama