Title:
半導体チップ
Document Type and Number:
Japanese Patent JP5052605
Kind Code:
B2
Abstract:
In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
Inventors:
Yoshihiro Tomura
Noboru Kazuhiro
Yuichiro Yamada
Kentaro Kumazawa
Iwase Teppei
Noboru Kazuhiro
Yuichiro Yamada
Kentaro Kumazawa
Iwase Teppei
Application Number:
JP2009515080A
Publication Date:
October 17, 2012
Filing Date:
May 09, 2008
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/60
Domestic Patent References:
| JP2000299338A | 2000-10-24 | |||
| JP2006019497A | 2006-01-19 |
Attorney, Agent or Firm:
Yohei Harada
Yoshihiro Morimoto
Yoshihiro Morimoto