Title:
ビーム接続構造
Document Type and Number:
Japanese Patent JP5100538
Kind Code:
B2
Inventors:
Hidetoshi Nakamura
Takuya Maekawa
Yoshio on the snow
Inukai Hiroaki
Satoshi Isaka
Takuya Maekawa
Yoshio on the snow
Inukai Hiroaki
Satoshi Isaka
Application Number:
JP2008175245A
Publication Date:
December 19, 2012
Filing Date:
July 04, 2008
Export Citation:
Assignee:
Sekisui Resin Co., Ltd.
International Classes:
E04H17/14
Domestic Patent References:
| JP3099762B2 |