Title:
電子部品の実装装置及び実装方法
Document Type and Number:
Japanese Patent JP5148309
Kind Code:
B2
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Inventors:
Katsuya Sano
Application Number:
JP2008024584A
Publication Date:
February 20, 2013
Filing Date:
February 04, 2008
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/60; B65H26/02
Domestic Patent References:
| JP9323850A | ||||
| JP2004289084A |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Ryo Hashimoto
Tetsuya Kazama
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Ryo Hashimoto
Tetsuya Kazama
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen