Title:
半導体素子接続用金線
Document Type and Number:
Japanese Patent JP5166738
Kind Code:
B2
Abstract:
A gold wire for semiconductor element connection having high strength and bondability. The connection has a limited amount of at least one element selected from calcium and rare earth elements, and a limited amount of at least one element selected from a group consisting of titanium, vanadium, chromium, hafnium, niobium, tungsten, and zirconium. The incorporation of a suitable amount of palladium or beryllium is preferred. The incorporation of calcium and rare earth element can improve the strength and young's modulus of a gold wire, and the incorporation of titanium and the like can reduce a deterioration in the roundness of press-bonded shape of press-bonded balls in the first bonding caused by the incorporation of calcium and rare earth elements. The bonding wire can simultaneously realize mechanical properties and bondability capable of meeting a demand for a size reduction in semiconductor and a reduction in electrode pad pitch.
Inventors:
Keiichi Kimura
Tomohiro Uno
Takashi Yamada
Nishibayashi Kagehito
Tomohiro Uno
Takashi Yamada
Nishibayashi Kagehito
Application Number:
JP2007015430A
Publication Date:
March 21, 2013
Filing Date:
January 25, 2007
Export Citation:
Assignee:
Nippon Steel & Sumikin Materials Co., Ltd.
International Classes:
C22C5/02; H01L21/60
Domestic Patent References:
| JP2000040710A | ||||
| JP61084346A | ||||
| JP6033168A | ||||
| JP2006032934A | ||||
| JP2006229202A |
Attorney, Agent or Firm:
Mamoru Ushiki
Shunta Naito
Hisataka Tanaka
Shunta Naito
Hisataka Tanaka