Title:
基板へのスパッタ薄膜の形成方法および搬送キャリア
Document Type and Number:
Japanese Patent JP5235223
Kind Code:
B2
Inventors:
Toshiyuki Koizumi
Xu Feng
Xu Feng
Application Number:
JP2011113994A
Publication Date:
July 10, 2013
Filing Date:
May 20, 2011
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/56; C03C17/245; H01B13/00
Domestic Patent References:
| JP10152776A | ||||
| JP2002235165A | ||||
| JP2002363743A | ||||
| JP2000199046A | ||||
| JP2002031711A |
Attorney, Agent or Firm:
Yoshihiro Shimizu
Shinichi Abe
Yuji Tsujida
Shinichi Abe
Yuji Tsujida