Title:
シール構造体
Document Type and Number:
Japanese Patent JP5248431
Kind Code:
B2
Inventors:
Fukuzawa Yoichi
Atsushi Nakatani
Atsushi Nakatani
Application Number:
JP2009164184A
Publication Date:
July 31, 2013
Filing Date:
July 10, 2009
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
H05K7/00; F16J15/06; H04M1/02; H05K5/06
Domestic Patent References:
| JP2008244422A | ||||
| JP2005325849A | ||||
| JP2002156044A | ||||
| JP2010087466A | ||||
| JP2005282776A |
Attorney, Agent or Firm:
Hiroshi Sano
Akio Ishii
Akio Ishii