Title:
樹脂封止型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5301023
Kind Code:
B2
Inventors:
Hamasaki Akie
Naofumi Izumi
Tomonori Shinoda
Naofumi Izumi
Tomonori Shinoda
Application Number:
JP2012241705A
Publication Date:
September 25, 2013
Filing Date:
November 01, 2012
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/56
Domestic Patent References:
| JP2003249510A | ||||
| JP200564239A | ||||
| JP200332061A | ||||
| JP2004343378A | ||||
| JP11251347A |
Attorney, Agent or Firm:
Patent corporation ssinpat
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