Title:
銅微粒子分散水溶液の製造方法、及び銅微粒子分散水溶液の保管方法
Document Type and Number:
Japanese Patent JP5306966
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive member having excellent conductivity and a small amount of impurities even when the conductive member is obtained by performing an application or the like of a copper fine particle dispersion aqueous solution with high dispersibility on a base material to be dried, and then firing the aqueous solution at a relatively low temperature of 250°C or below.SOLUTION: In a copper fine particle dispersion aqueous solution, copper fine particles having an average particle diameter of primary particles of 1-150 nm are covered with a dispersant and dispersed in an aqueous solution. A method of producing the copper fine particle dispersion aqueous solution includes: (i) a step (step 1) of obtaining a water soluble copper ammine complex by the reaction of copper ions with ammonia in an ammonia aqueous solution adjusted to pH 9.2 or more with a pH adjuster in the presence of a dispersant; and (ii) a step (step 2) of forming copper fine particles having the surfaces at least partially covered with the dispersant, by an electrolytic reduction reaction of the copper ammine complex in a reduction reaction aqueous solution containing the copper ammine complex obtained in the step 1. The copper fine particle dispersion aqueous solution is produced without including a compound including atoms except a copper element, a carbon atom, a hydrogen atom, an oxygen atom and a nitrogen atom. The copper fine particle dispersion aqueous solution is applied on a base material to be dried, and then fired to form a conductive member.
Inventors:
Yusuke Yamada
Hidemichi Fujiwara
Nishikubo Hideo
Shunji Masumori
Hidemichi Fujiwara
Nishikubo Hideo
Shunji Masumori
Application Number:
JP2009246552A
Publication Date:
October 02, 2013
Filing Date:
October 27, 2009
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25C5/02; B01D61/02; B01D61/14; B01J13/00; B22F1/00; C09K23/42; C09K23/52; C09K23/56; C25C1/12
Domestic Patent References:
| JP2008231564A | ||||
| JP2008519156A | ||||
| JP5320972A | ||||
| JP2007270283A |
Attorney, Agent or Firm:
Isamu Hosoi
Atsushi Naka
Atsushi Naka