Title:
溶接ワイヤ送給装置及びレーザ・アークハイブリッド溶接装置
Document Type and Number:
Japanese Patent JP5353181
Kind Code:
B2
Inventors:
Kotaro Inose
Katsura Owaki
Tomohiro Sugino
Junko Kambayashi
Katsura Owaki
Tomohiro Sugino
Junko Kambayashi
Application Number:
JP2008274537A
Publication Date:
November 27, 2013
Filing Date:
October 24, 2008
Export Citation:
Assignee:
Ihi Co., Ltd.
International Classes:
B23K9/127; B23K9/12; B23K9/133; B23K9/16; B23K26/00; B23K26/21; B23K26/346
Domestic Patent References:
| JP57052272U | ||||
| JP2001293575A | ||||
| JP2005238282A | ||||
| JP3503738A | ||||
| JP10324458A |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe