Title:
半導体装置及びその製造方法、並びに表示装置
Document Type and Number:
Japanese Patent JP5355117
Kind Code:
B2
Inventors:
Yamagata Aritomo
Inoue Japanese style
Takumi Nakahata
Nobuaki Ishiga
Kensuke Nagayama
Naoki Tsumura
Inoue Japanese style
Takumi Nakahata
Nobuaki Ishiga
Kensuke Nagayama
Naoki Tsumura
Application Number:
JP2009021512A
Publication Date:
November 27, 2013
Filing Date:
February 02, 2009
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L29/417; G09F9/30; H01L21/28; H01L21/3205; H01L21/336; H01L21/768; H01L23/532; H01L29/786
Domestic Patent References:
| JP2008010801A | ||||
| JP2009278057A | ||||
| JP63178559A | ||||
| JP11284195A | ||||
| JP2008098192A |
Foreign References:
| WO2008050710A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita