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Title:
電子装置および複合電子装置
Document Type and Number:
Japanese Patent JP5360228
Kind Code:
B2
Abstract:
DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Inventors:
Aoki Shinmitsu
Kubo Hideo
Yoshinori Unzuka
Atsushi Taniguchi
Application Number:
JP2011543915A
Publication Date:
December 04, 2013
Filing Date:
October 16, 2009
Export Citation:
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Assignee:
富士通株式会社
International Classes:
H05K7/20
Domestic Patent References:
JP2004363236A2004-12-24
JPH0252493U1990-04-16
JP2007502027A2007-02-01
JP2008270374A2008-11-06
Attorney, Agent or Firm:
Hiroaki Sakai