Title:
インターポーザー及びインターポーザーの製造方法
Document Type and Number:
Japanese Patent JP5362569
Kind Code:
B2
Abstract:
The present invention is intended to provide an interposer that can lower mounting height and draw multiple wires with the smallest possible number of layers, and that is suitable for high-volume signal transmissions between electronic components, and the interposer of the present invention comprises:
a first insulating layer composed of an inorganic material;
a first land formed in the first insulating layer;
a second land formed in the first insulating layer;
a first wire formed in the first insulating layer to electrically connect the first land and the second land;
a second insulating layer formed on a first surface of the first insulating layer, the first land, the second land, and the first wire, having a first opening for a first via conductor connected to the second land;
a first pad for loading a first electronic component mounted on a second side of the first insulating layer;
a second pad for loading a second electronic component, formed on the second insulating layer;
a second wire formed on the second insulating layer; and
a first via conductor formed in the first opening to electrically connect the first land and the second wire,
wherein the first pad and the second pad are electrically connected via the first wire and the second wire, and the second wire has a longer wire length and a greater thickness than the first wire.
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Inventors:
Ichi Sakamoto
Shuichi Kono
Daisuke Komatsu
Hiroshi Segawa
Shuichi Kono
Daisuke Komatsu
Hiroshi Segawa
Application Number:
JP2009530730A
Publication Date:
December 11, 2013
Filing Date:
October 09, 2008
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L25/065; H01L23/32; H01L25/07; H01L25/18
Domestic Patent References:
| JPH0521635A | 1993-01-29 |
Attorney, Agent or Firm:
Atomi International Patent Office