Title:
アンテナ装置
Document Type and Number:
Japanese Patent JP5368730
Kind Code:
B2
Abstract:
Provided is an antenna device with which the degradation of characteristics arising from the fact that the antenna has been miniaturized and made thinner is reduced and in which it is possible to increase the gain and to widen the coverage area by improving the characteristics of the internal antenna. The device is equipped with a circuit board, a wireless circuit component which is mounted on the substrate, an internal antenna which is connected to the wireless circuit component which is mounted on the substrate, a circuit-side ground pattern which is connected to the wireless circuit component which is mounted on the substrate, and a dedicated antenna ground paten which is connected to the internal antenna which is mounted on the circuit board.
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Inventors:
Shinsuke Yukimoto
Yokoshima Takao
Yokoshima Takao
Application Number:
JP2008126005A
Publication Date:
December 18, 2013
Filing Date:
May 13, 2008
Export Citation:
Assignee:
Mitsubishi Cable Industries, Ltd.
Mitsubishi Materials Corporation
Mitsubishi Materials Corporation
International Classes:
H01Q1/48; H01Q9/16; H01Q9/30
Domestic Patent References:
| JP2008011281A | ||||
| JP2001168625A |
Attorney, Agent or Firm:
Hideyuki Sugiura