Title:
基材の加工方法
Document Type and Number:
Japanese Patent JP5394261
Kind Code:
B2
Abstract:
The invention provides for a method of machining a substrate which includes the step of machining the substrate in an interrupted machining, impact machining or combination thereof operation using a tool which includes a tool component comprising a layer of polycrystalline diamond (12) having a working surface (16), a softer layer (20) containing a metal and bonded to the working surface (16) of the polycrystalline diamond layer (12) along an interface, the region (22) of the layer of polycrystalline diamond (12) adjacent the interface containing some metal from the softer layer (20).
Inventors:
Praetorius, Cornelius, Johannes
Harden, Peter, Michael
Harden, Peter, Michael
Application Number:
JP2009551300A
Publication Date:
January 22, 2014
Filing Date:
February 28, 2008
Export Citation:
Assignee:
Element Six (Production) (Proprietary) Limited
International Classes:
B23D61/04; B23B27/14; B23B27/20; B23B51/00; B23D61/14; B27G13/08
Domestic Patent References:
| JP58074586A | ||||
| JP61270285A | ||||
| JP8206902A | ||||
| JP2001293602A |
Foreign References:
| WO1993025795A1 | ||||
| US5135061 | ||||
| US5348108 | ||||
| US5543210 | ||||
| US6779951 | ||||
| GB2335217A | ||||
| GB2335682A |
Attorney, Agent or Firm:
Asamura patent office
Hideto Asamura
Hajime Asamura
Katsunori Shirae
Yutaka Yoshida
Toru Mori
Tadashi Tanaka
Ken Kanai
Hideto Asamura
Hajime Asamura
Katsunori Shirae
Yutaka Yoshida
Toru Mori
Tadashi Tanaka
Ken Kanai