Title:
半導体基板の枚葉式スピン洗浄方法
Document Type and Number:
Japanese Patent JP5405137
Kind Code:
B2
Inventors:
Yoshihiro Nojima
Nobu Kawai
Takeshi Suwa
Nobu Kawai
Takeshi Suwa
Application Number:
JP2009031139A
Publication Date:
February 05, 2014
Filing Date:
February 13, 2009
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2003203892A | ||||
| JP2002124502A | ||||
| JP2001053051A | ||||
| JP2008226900A | ||||
| JP10340876A |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Masayuki Okamoto
Fukagawa Eri
Satoshi Morimoto
Kyoko Tsunoda
Takashi Matsuzaki
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Masayuki Okamoto
Fukagawa Eri
Satoshi Morimoto
Kyoko Tsunoda
Takashi Matsuzaki