Title:
熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置
Document Type and Number:
Japanese Patent JP5421546
Kind Code:
B2
Inventors:
Hayato Kotani
Naoyuki Urasaki
Naoyuki Urasaki
Application Number:
JP2008122014A
Publication Date:
February 19, 2014
Filing Date:
May 08, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08K3/00; C08L33/00; H01L23/29; H01L23/31; H01L33/48; H01L33/50; H01L33/56; H01L33/60; H01L33/62
Attorney, Agent or Firm:
Hidekazu Miyoshi