Title:
ウェハ研磨装置
Document Type and Number:
Japanese Patent JP5486095
Kind Code:
B2
Abstract:
A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.
Inventors:
Lee, Hyunlac
Application Number:
JP2012547952A
Publication Date:
May 07, 2014
Filing Date:
January 05, 2011
Export Citation:
Assignee:
Ergie Syltron Inc.
International Classes:
B24B37/08; B24B37/005; B24B37/11; H01L21/304
Domestic Patent References:
| JP11090801A | ||||
| JP10235556A | ||||
| JP2000108022A | ||||
| JP2001030158A | ||||
| JP2000317820A | ||||
| JP2009285774A | ||||
| JP6126611A | ||||
| JP10113856A |
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Mie Hideki
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Mie Hideki