Title:
超電導化合物用基板及びその製造方法
Document Type and Number:
Japanese Patent JP5517196
Kind Code:
B2
Abstract:
Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed bysuchbonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
Inventors:
Hironao Okayama
Koji Nanbu
Akira Kaneko
Hajime Ota
Kotaro Oki
Takashi Yamaguchi
Kazuhiko Hayashi
Kazuya Omatsu
Koji Nanbu
Akira Kaneko
Hajime Ota
Kotaro Oki
Takashi Yamaguchi
Kazuhiko Hayashi
Kazuya Omatsu
Application Number:
JP2009265285A
Publication Date:
June 11, 2014
Filing Date:
November 20, 2009
Export Citation:
Assignee:
TOYO KOHAN CO.,LTD.
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Industries, Ltd.
International Classes:
H01B12/06; C22F1/08; H01B13/00; C22C9/00; C22F1/00
Domestic Patent References:
| JP2007115562A | ||||
| JP2008266686A | ||||
| JP2006127847A |
Attorney, Agent or Firm:
Patent business corporation Ota patent office