Title:
チップコネクタ
Document Type and Number:
Japanese Patent JP5542763
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electric coupling method of a contact point for minimizing a risk that a yield of an expensive component is deteriorated by a post-processing following stacking of conventional technology for generating an electric contact point after stacking a chip.SOLUTION: The method is to electrically couple a first contact point on a first wafer with a second contact point on a second wafer. The first contact point includes a rigid material and the second contact point includes a material having malleability compared to the rigid material. When they are put together, they are coupled so that the rigid material penetrates the malleable material. The rigid material and the malleable material are both conductive. The method includes: a step for bringing the rigid material into contact with the malleable material; a step for adding force to either the first contact point or the second contact point for making the rigid material penetrate the malleable material; a step for heating the rigid material and the malleable material for softening the malleable material; and a step for restraining the malleable material into a previously specified region.
Inventors:
John トレッツァ
John cola alder
Gregory デュドフ
John cola alder
Gregory デュドフ
Application Number:
JP2011207007A
Publication Date:
July 09, 2014
Filing Date:
September 22, 2011
Export Citation:
Assignee:
Cue fur Asset Limited. El. El. See. CUFER ASSET LTD. L. L. C.
International Classes:
H01L25/065; H01L23/52; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki