Title:
樹脂封止型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5592526
Kind Code:
B2
Inventors:
Wada 勉
Masuda Masachika
Masuda Masachika
Application Number:
JP2013080191A
Publication Date:
September 17, 2014
Filing Date:
April 08, 2013
Export Citation:
Assignee:
ルネサス electronics incorporated company
International Classes:
H01L21/52; H01L23/12
Attorney, Agent or Firm:
Tsutsui Daiwa