Title:
Ｓｎ−Ｃｕ系鉛フリーはんだ合金
Document Type and Number:
Japanese Patent JP5614507
Kind Code:
B2
Abstract:
Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.
Inventors:
大西 司
吉川 俊策
石橋 世子
藤巻 礼
吉川 俊策
石橋 世子
藤巻 礼
Application Number:
JP2013551698A
Publication Date:
October 29, 2014
Filing Date:
December 25, 2012
Export Citation:
Assignee:
千住金属工業株式会社
International Classes:
B23K35/26; B23K35/14; C22C13/00
Domestic Patent References:
| JP2001058287A | 2001-03-06 | |||
| JP2011192652A | 2011-09-29 | |||
| JP2007190603A | 2007-08-02 | |||
| JP2001129682A | 2001-05-15 | |||
| JP2010005692A | 2010-01-14 | |||
| JP2001269772A | 2001-10-02 | |||
| JP2008031550A | 2008-02-14 |
Foreign References:
| WO2011027820A1 | 2011-03-10 |
Attorney, Agent or Firm:
Mochitoshi Watanabe
Haruko Miwa
Hideaki Ito
Mitsuhashi Fumio
Haruko Miwa
Hideaki Ito
Mitsuhashi Fumio