Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5627835
Kind Code:
B2
Abstract:
A semiconductor chip includes a substrate, an electrode pad formed on the substrate, an insulating layer covering the substrate and the electrode pad, and having an opening exposing a portion of a surface of the electrode pad, a first conductive layer formed on the exposed portion of the surface of the electrode pad and extending to a surface of the insulating layer, and a second conductive layer formed on the first conductive layer, covering the first conductive layer in a plan view, and having an outer edge portion which is located further out than an outer edge of the first conductive layer in a plan view. The outer edge portion of the second conductive layer has at least one curved portion. At least one portion of the curved portion is located between the outer edge of the first conductive layer and an outer edge of the second conductive layer in a plan view.
Inventors:
鮫島 克己
Application Number:
JP2007298361A
Publication Date:
November 19, 2014
Filing Date:
November 16, 2007
Export Citation:
Assignee:
ローム株式会社
International Classes:
H01L21/60; H01L23/12
Attorney, Agent or Firm:
Kosaku Inaoka
Kawasaki Real husband
京村 Junji
Kawasaki Real husband
京村 Junji