Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5629977
Kind Code:
B2
Inventors:
村瀬 康裕
Application Number:
JP2009096084A
Publication Date:
November 26, 2014
Filing Date:
April 10, 2009
Export Citation:
Assignee:
日本電気株式会社
International Classes:
H01L21/338; H01L29/778; H01L29/812
Attorney, Agent or Firm:
House ON 健