Title:
マイクロスピーカの振動板の接合構造
Document Type and Number:
Japanese Patent JP5654103
Kind Code:
B2
Abstract:
The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
Inventors:
キム・ジフン
クォン・ジョンハク
イ・ジュンヒョン
オ・ヒョンテク
クォン・ジョンハク
イ・ジュンヒョン
オ・ヒョンテク
Application Number:
JP2013176514A
Publication Date:
January 14, 2015
Filing Date:
August 28, 2013
Export Citation:
Assignee:
イーエム−テック・カンパニー・リミテッドＥＭ−ＴＥＣＨ．Ｃｏ．，Ｌｔｄ．
International Classes:
H04R9/02; H04R7/12; H04R7/18
Attorney, Agent or Firm:
Patent business corporation Tsukuni
Hajime Tsukuni
Yasuo Yanagibashi
Ito 佐保子
Keiko Ozawa
Toshio Miyake
Yasuhiro Kokuni
Yoko Tanaka
Yoshinori Ubukawa
Akio Shibata
Hajime Tsukuni
Yasuo Yanagibashi
Ito 佐保子
Keiko Ozawa
Toshio Miyake
Yasuhiro Kokuni
Yoko Tanaka
Yoshinori Ubukawa
Akio Shibata