Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5654392
Kind Code:
B2
Inventors:
加藤 伸二郎
Application Number:
JP2011054899A
Publication Date:
January 14, 2015
Filing Date:
March 13, 2011
Export Citation:
Assignee:
セイコーインスツル株式会社
International Classes:
H01L21/3205; H01L21/336; H01L21/768; H01L23/522; H01L29/78
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura
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