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Title:
剣山型マイクロニードルのアプリケータデバイス
Document Type and Number:
Japanese Patent JP5663792
Kind Code:
B2
Abstract:
Provided is a microneedle device which protects a microneedle, has an easily portable shape, is free from such problems as breakage of small needles in the step of puncturing the skin with the microneedle, and ensures appropriate skin puncture to administer a drug. By studying the relationship between the device to be pressed to the skin and the height of the elevation of the skin surface during the pressing, it is found that there is a positive correlation between the placement and interval of skin fixing members and the height of the elevation of the skin. It is furthermore found that the elevated skin surface is always parallel to the flat plate of the device. This reveals that since the microneedle installed in the device can be inserted at right angle to the skin surface, the skin can reliably be punctuated avoiding the breakage etc. of the small needles of the microneedle. Thus, a microneedle patch which is easily portable and ensures convenient drug administration to the skin can be produced.

Inventors:
小林 勝則
濱本 英利
Application Number:
JP2011525791A
Publication Date:
February 04, 2015
Filing Date:
August 04, 2010
Export Citation:
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Assignee:
株式会社 メドレックス
International Classes:
A61M37/00
Domestic Patent References:
JP2000037456A2000-02-08
JPS6412538U1989-01-23
JP2008212588A2008-09-18
JP2009095410A2009-05-07
JP2005516737A2005-06-09
JP2007307380A2007-11-29
JP2008543527A2008-12-04
JP2000037456A2000-02-08
JPS6412538U1989-01-23
Attorney, Agent or Firm:
Takashima 1
Kyoko Doi
Kamata 光宜
Tamura Yasaka child
Murata Miyuki
Koike 順造
Hirofumi Toma



 
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