Title:
チップ圧着装置およびその方法
Document Type and Number:
Japanese Patent JP5680684
Kind Code:
B2
Abstract:
Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.
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Inventors:
洪 誌宏
Application Number:
JP2013027320A
Publication Date:
March 04, 2015
Filing Date:
February 15, 2013
Export Citation:
Assignee:
印能科技股▲ふん▼有限公司
International Classes:
H01L21/52
Attorney, Agent or Firm:
Noriyasu Ikeda
Shuichi Fukuda
Shuichi Fukuda