Title:
ホットメルト要素を有する電気要素
Document Type and Number:
Japanese Patent JP5688965
Kind Code:
B2
Abstract:
The invention relates to an electrical component (1) comprising at least one cable element (2), at least one solder joint (12), at least one hotmelt element (22) and at least one substrate element (8). The cable element (2) is connected with the substrate element (8) by the solder joint (12). To improve the data transmission rate, the at least one solder joint (12) is not embedded in the hotmelt element (22). Preferably, the solder joint (12) is not covered the hotmelt material of the hotmelt element (22).
Inventors:
ヘルト・ファン・ティエル
ヤン・ファン・ティルブルフ
ヤン・ファン・ティルブルフ
Application Number:
JP2010289475A
Publication Date:
March 25, 2015
Filing Date:
December 27, 2010
Export Citation:
Assignee:
タイコ・エレクトロニクス・ネーデルランド・ベスローテン・フェンノートシャップＴＹＣＯ ＥＬＥＣＴＲＯＮＩＣＳ ＮＥＤＥＲＬＡＮＤ ＢＶ
International Classes:
H01R13/719; H01R13/58; H01R13/66
Attorney, Agent or Firm:
Mutsumi Sameshima
Yasuo Tamura
Yasuo Tamura