Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5691831
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can inhibit detachment of a mold resin.SOLUTION: A semiconductor device comprises :a semiconductor chip 20; a mounting component 10 having one surface 10a, and a conductive member mounting region formed on the one surface 10a, on which the semiconductor chip 20 is mounted via a conductive member 30; and a mold resin 40 encapsulating at least a part of the mounting component 10 and the semiconductor chip 20. The mounting component 10 has an irregularly-shaped portion contacting the mold resin 40 on the one surface 10a. A hydroxide 13 is formed on a surface of the portion of the mounting component 10 contacting the mold resin 40.
Inventors:
Kazuya Nomura
Hiroyuki Wado
Hiroyuki Wado
Application Number:
JP2011111137A
Publication Date:
April 01, 2015
Filing Date:
May 18, 2011
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/50; H01L23/12; H01L23/28; H01L23/34
Domestic Patent References:
| JP11163210A | ||||
| JP2003318346A | ||||
| JP2007088211A | ||||
| JP2002326252A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office