Title:
半導体モジュール用冷却器及び半導体モジュール
Document Type and Number:
Japanese Patent JP5692368
Kind Code:
B2
Abstract:
A semiconductor module and a cooler capable of effectively cooling a semiconductor device are provided. The semiconductor module supplies a coolant to a water jacket (2A) constituting the cooler from outside and cools a circuit element unit arranged on an outer surface of a fin base. The semiconductor module comprises fins (2C) thermally connected to the circuit element unit, and a coolant introduction flow channel (21) which is arranged in the water jacket (2A), which extends from a coolant inlet (24), and which includes a guide section (21Si) that is inclined so as to guide the coolant toward one side surface of the fins (2C). In type G, an inlet section (21a) that guides the coolant to the coolant introduction flow channel (21) is formed into a tapered cross-sectional shape, and the flow channel width thereof is varied so that a width (w2) at a starting end section of the coolant introduction flow channel (21) is narrower than a width (w1) of an outlet (25).
Inventors:
Hirohara Gohara
Akira Ryukaku
Takeshi Ichimura
Akira Ryukaku
Takeshi Ichimura
Application Number:
JP2013512011A
Publication Date:
April 01, 2015
Filing Date:
April 16, 2012
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/473; H01L25/07; H01L25/18
Domestic Patent References:
| JP2009147107A | 2009-07-02 | |||
| JP2006324647A | 2006-11-30 | |||
| JP2007250701A | 2007-09-27 | |||
| JP2006295178A | 2006-10-26 | |||
| JP2010203694A | 2010-09-16 | |||
| JP2006210819A | 2006-08-10 | |||
| JP2010153785A | 2010-07-08 |
Foreign References:
| WO2009069578A1 | 2009-06-04 |
Attorney, Agent or Firm:
Takeshi Hattori