Title:
ウエハの接合方法及び接合部の構造
Document Type and Number:
Japanese Patent JP5716627
Kind Code:
B2
Abstract:
A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.
Inventors:
Takeshi Fujiwara
Toshiaki Okuno
Katsuyuki Inoue
Junya Yamamoto
Kenichi Hinuma
Yoshiki Ashihara
Miyachi Takaaki
Toshiaki Okuno
Katsuyuki Inoue
Junya Yamamoto
Kenichi Hinuma
Yoshiki Ashihara
Miyachi Takaaki
Application Number:
JP2011222284A
Publication Date:
May 13, 2015
Filing Date:
October 06, 2011
Export Citation:
Assignee:
OMRON Corporation
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2011192847A | ||||
| JP2005285882A | ||||
| JP2001057468A | ||||
| JP2000288770A |
Attorney, Agent or Firm:
Masafusa Nakano