Title:
発光ダイオードパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP5721797
Kind Code:
B2
Abstract:
An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.
Inventors:
Huang Tetsu Sen
Chen Hama
Chen Rin
Fumiyoshi Sone
Yellow Ikuyo
Chen Hama
Chen Rin
Fumiyoshi Sone
Yellow Ikuyo
Application Number:
JP2013190302A
Publication Date:
May 20, 2015
Filing Date:
September 13, 2013
Export Citation:
Assignee:
ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
International Classes:
H01L33/62
Domestic Patent References:
| JP2000294832A | ||||
| JP2011176256A | ||||
| JP2011151239A | ||||
| JP4111767U | ||||
| JP4105562U | ||||
| JP2008251664A | ||||
| JP4168778A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro