Title:
ホットメルト接着剤その他の熱可塑性材料を供給するためのモジュラー式システム
Document Type and Number:
Japanese Patent JP5722544
Kind Code:
B2
Abstract:
A modular system, for delivering hot melt adhesive or other thermoplastic materials, comprises a modular metering assembly, having a plurality of metering stations disposed therein, which is able to be attachably and detachably mounted upon a modular tank or supply assembly. Alternatively, one or more of the plurality of metering stations may be disposed externally of the modular metering assembly, and alternatively still further, one or more additional modular metering assemblies may be attachably and detachably connected to the first modular metering assembly. In this manner, the entire modular system exhibits enhanced versatility and flexibility in order to effectively implement different material application procedures that may be required for different end-user customers.
More Like This:
Inventors:
McAfee, Grant
Barghetto, Daniel Dee.
Schotten, Christoph
Barghetto, Daniel Dee.
Schotten, Christoph
Application Number:
JP2009549184A
Publication Date:
May 20, 2015
Filing Date:
February 01, 2008
Export Citation:
Assignee:
Illinois Tours Works Inc.
International Classes:
B05C11/10; B67D7/80; B01J4/00; B01J4/02; B05C5/04; B05C21/00
Domestic Patent References:
| JP2005313170A | ||||
| JP9192577A | ||||
| JP62001512A |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Hirose Shigeki
Yoshimitsu Mizumoto
Niwa Masataka
Jun Tsuruta
Tetsuro Shimada
Hirose Shigeki
Yoshimitsu Mizumoto
Niwa Masataka