Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5741526
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of temporarily molding a plurality of semiconductor elements and exposing a heat radiation plate from a mold resin with a simple structure and simplifying a manufacturing process thereof.SOLUTION: A middle-side electrode 5 including two semiconductor elements stacked via a mold resin material 10 and configured to connect each electrode is bent inside the mold resin material 10. An electrode connected to a surface opposite to a surface to which each of the semiconductor elements faces when viewed from top in the direction in which the semiconductor elements are stacked is exposed from the mold resin material 10.
Inventors:
Hirotaka Ohno
Application Number:
JP2012122826A
Publication Date:
July 01, 2015
Filing Date:
May 30, 2012
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L25/07; H01L23/34; H01L23/48; H01L25/18
Domestic Patent References:
| JP2009295794A | ||||
| JP2004193476A | ||||
| JP2009071059A | ||||
| JP2004022601A | ||||
| JP2004311685A | ||||
| JP2010251711A | ||||
| JP2013153010A |
Foreign References:
| WO2008018332A1 |
Attorney, Agent or Firm:
Kaiyu International Patent Office