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Patent Searching and Data


Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5755939
Kind Code:
B2
Abstract:
The invention is directed to a semiconductor device which is manufactured by a BiCMOS process in which a process of manufacturing a V-NPN transistor is rationalized. Furthermore, the hFE of the transistor is adjusted to a large value. An N type base width control layer is formed being in contact with a bottom portion of a P type base region under an N+ type emitter region. The N type base width control layer shallows a portion of the P type base region under the N+ type emitter region partially. The P type base region is formed by using a process of forming a P type well region, and the N type base width control layer is formed by using a process of forming an N type well region, thereby achieving the process rationalization.

Inventors:
Seiji Otake
Application Number:
JP2011115618A
Publication Date:
July 29, 2015
Filing Date:
May 24, 2011
Export Citation:
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Assignee:
Semiconductor Components Industries Limited Liability Company
International Classes:
H01L21/8249; H01L21/331; H01L21/8222; H01L21/8248; H01L27/06; H01L29/732
Domestic Patent References:
JP56152258A
JP5129535A
JP1244660A
JP8204041A
JP2004311684A
JP4370964A
JP63164356A
JP63269560A
JP2003142613A
JP2001274257A
JP7335662A
JP53067367A
JP2003234423A
Foreign References:
US20040212043
Attorney, Agent or Firm:
Katsuhiko Sudo
Yasuhide Kamada