ポリヒドロキシ化合物、エポキシ樹脂、熱硬化性樹脂組成物、その硬化物及び半導体封止材料

Title:

ポリヒドロキシ化合物、エポキシ樹脂、熱硬化性樹脂組成物、その硬化物及び半導体封止材料

Document Type and Number:

Japanese Patent JP5760794

Kind Code:

B2

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Inventors:

Ichiro Ogura
Yousuke Hirota
Shinya Nakamura
Yoshiyuki Takahashi
Norio Nagae

Application Number:

JP2011160869A

Publication Date:

August 12, 2015

Filing Date:

July 22, 2011

Export Citation:

Assignee:

DIC Corporation

International Classes:

C08G59/06; C07C39/15; H01L23/29; H01L23/31

Domestic Patent References:

Attorney, Agent or Firm:

Kono Tsuyo

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